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#1 |
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diyAudio Member
Join Date: Oct 2003
Location: USA
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Yesterday I was replacing some parts on a DAC project I'm building. I was using a desoldering braid and a Hakko soldering station set to 600 degrees F. I desoldered the parts to remove them and soldered new parts in afterwards.
After I was done, I noticed that there were slight "fracture" marks around some of the solder pads. These marks look like little fractures in the board material - they kind of look like whitish chips that fracture into the depth of the board a little bit. Is this due to overheating? I've changed out parts for many years and never noticed this until now. The board looks like a good 4 layer fiberglass epoxy board. The only thing I did differently that I can think of is that I cleaned the flux off the board with Q-tips and alcohol on several different occasions. Could the alcohol have dried up the board somewhat causing the cracking when heat was applied later? I don't think the extent of the fracturing should affect the board too much since It's in a low stress environment. The board does have a 6DJ8 tube on it, though, so I'm a bit worried that the heating/ cooling might cause the little cracks to expand and eventually form a bigger crack. Anyone have any insight on this? Thanks, KT |
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#2 |
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Banned
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Picture ?
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#3 | |
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diyAudio Member
Join Date: Oct 2003
Location: USA
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Quote:
I'll post some ASAP. Thanks, KT |
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