BWRX said:Can you fashion a small piece of metal (preferably aluminum or copper) to the package with double sided tape or super glue? That would be better than any kind of spongy, non-metal material.
I guess I was wanting to couple it to the case, but it's plastic so maybe that won't do all that good, but in my head I was thinking it would work better than just a piece of metal... it's worth a try though.
Fujipoly has gap filler pads to transfer heat.
http://www.fujipoly.com/products/ge...roductLine=Sarcon_Thermal_Interface_Materials
http://www.fujipoly.com/products/ge...roductLine=Sarcon_Thermal_Interface_Materials
You could also try
http://www.lairdtech.com/pages/products/Gap-Filler-Product-Line.asp
and
http://www.bergquistcompany.com/tm_gap_pad_list.cfm
look for a low pressure material with a high W/mK rating and were possible try to use the thinnest material that will still conform to your component.
The plastic box however is you enemy, you could use the material only as a medium for coupling the heat to another more suitable heat spreader or heat sink.
http://www.lairdtech.com/pages/products/Gap-Filler-Product-Line.asp
and
http://www.bergquistcompany.com/tm_gap_pad_list.cfm
look for a low pressure material with a high W/mK rating and were possible try to use the thinnest material that will still conform to your component.
The plastic box however is you enemy, you could use the material only as a medium for coupling the heat to another more suitable heat spreader or heat sink.
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