Go Back   Home > Forums > >
Home Forums Rules Articles diyAudio Store Blogs Gallery Wiki Register Donations FAQ Calendar Search Today's Posts Mark Forums Read

Digital Source Digital Players and Recorders: CD , SACD , Tape, Memory Card, etc.

Copper pour layout strategies
Copper pour layout strategies
Please consider donating to help us continue to serve you.

Ads on/off / Custom Title / More PMs / More album space / Advanced printing & mass image saving
Thread Tools Search this Thread
Old 23rd August 2004, 01:48 AM   #1
Wodgy is offline Wodgy  United States
diyAudio Member
Join Date: Jul 2003
Send a message via AIM to Wodgy
Default Copper pour layout strategies

If I'm designing a two-sided PCB, I understand that using a "copper pour" in empty PCB areas can help reduce/prevent noise. What is the best way to do this? Specifically:
- should I do a copper pour on both the top and bottom sides of the PCB, or just on one side?
- if I do a copper pour on both sides of the PCB, should they both be used as "ground planes" or should just one be used as the "ground plane" and the other used for V+? won't the latter create a lot of capacitance?
  Reply With Quote
Old 23rd August 2004, 03:05 AM   #2
jackinnj is offline jackinnj  United States
diyAudio Member
jackinnj's Avatar
Join Date: Apr 2002
Location: Llanddewi Brefi, NJ
Copper pour layout strategies
there are a lot of compromises -- on the low noise preamp I just made (for replacing the circuitry in my HP465A) -- using the SSM2019 -- I defined the star ground system as NET 1, the ground planes as NET 0. All of the signal and power grounds are on NET 1 returning to the star. I then poured NET 0 on the top, placed a grid of vias at 200 mil intervals (where allowable) and poured copper for NET 0 on the bottom. The vias connect top to bottom and I over-ride the DRC to connect NET 0 and NET 1 at the star. Using a grid of vias is mentioned by Analog Devices (where I can't remember

I was actually forced into this by Ultiboard 7 since it was balky when pouring the ground planes in and of themselves.

Of course, this presupposes that you are transferring a schematic from your sim software to your pcb software. With Ultiboard you can redefine a net, I suppose it's the same in Eagle.

If you find working with groundplanes difficult, you can always use 3M adhesive backed copper foil -- this helped me out a lot with a noisy ADC environment. The 3M foil is solderable, quite easily.
  Reply With Quote


Copper pour layout strategiesHide this!Advertise here!
Thread Tools Search this Thread
Search this Thread:

Advanced Search

Posting Rules
You may not post new threads
You may not post replies
You may not post attachments
You may not edit your posts

BB code is On
Smilies are On
[IMG] code is On
HTML code is Off

Forum Jump

Similar Threads
Thread Thread Starter Forum Replies Last Post
Eagle vs. Sprint-Layout for PCB design/layout hollowman Parts 11 12th January 2014 09:01 PM
Copper going away at 350 ? Bernhard Parts 8 12th May 2008 07:28 PM
Audiophile - Cream of the crop choices, strategies and opinions MLDV Car Audio 7 25th April 2008 05:54 PM
Copper heatsink tweak - Thermaltake Copper Heatsinks Ruach Digital Source 16 23rd September 2006 10:59 PM
Need info on CIRC strategies halcyon Digital Source 1 5th August 2003 07:56 AM

New To Site? Need Help?

All times are GMT. The time now is 05:17 AM.

Search Engine Optimisation provided by DragonByte SEO (Pro) - vBulletin Mods & Addons Copyright © 2018 DragonByte Technologies Ltd.
Resources saved on this page: MySQL 16.67%
vBulletin Optimisation provided by vB Optimise (Pro) - vBulletin Mods & Addons Copyright © 2018 DragonByte Technologies Ltd.
Copyright ©1999-2018 diyAudio