Picking a .01uf or a .1uf as a bypass for dig chips? - diyAudio
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Old 25th September 2009, 08:09 PM   #1
phrarod is offline phrarod  United States
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Default Picking a .01uf or a .1uf as a bypass for dig chips?

I put some Silmic II on the dac chips in a Valab dac that runs 8 dac chips in parallel. The Silmic's are a little soft on the top and someone recommended bypassing them with a .1uF film cap. I don't have enough .1uF Wima's but I do have enough .01uF film caps by Vishay.

What would be the difference between using a .01 and .1 in this application?
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Old 26th September 2009, 07:08 AM   #2
Mooly is offline Mooly  United Kingdom
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In the past I usually add a 0.1 surface mount ceramic directly on the print between the legs off any small electroylitics.
If you use caps "with legs" the inductance of these negate the very result you are looking for, namely a low impedance path at HF.
To make matters worse if there IS any HF component across the electroylitic then adding a 0.1 etc can make matters worse if it causes resonance with the internal self inductance of the cap. The answer as always is to back up all you do with careful measurements.
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Old 26th September 2009, 07:20 AM   #3
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My opinion here is 10-100 nF and preferable 1206 or 0805 caps but I'll suspect that the product already has sufficient decoupling if it's a commercial product.
/Per-Anders (my first name) or P-A as my friends call me
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Last edited by peranders; 26th September 2009 at 07:24 AM.
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