Build Thread for TPA BIII + Ian Async I2S FIFO + OPC NTD1 + Salas SSLV - Page 48 - diyAudio
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Old 3rd March 2013, 01:11 AM   #471
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Soldered all the components except the FETs and Zfoils. Thinking to mount the unit onto a 2mm copper sheet and use it as heat pipe and connect to the heatsink on the case.
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Old 3rd March 2013, 01:56 AM   #472
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you cant attach directly? remember adding any thermal interface, no matter how good, makes the performance worse, not better and you will be adding at least 2. also can you guaranty that the copper will be perfectly flat? if its not you will not have good thermal contact and could burn a part.

one tip for this build, use PCB material or similar as shims for the zfoils to make all the parts level and just initially attach to the heatsink with just the 4 main holes. the legs on the zfoils are quite thin and if one of your screws catches in one of the wholes as you are attaching, or removing from the heatsink it will lift up and can break, even if you go around loosening each screw a couple turns at a time. once fully tested you can add the screws through the parts if you wish
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Old 3rd March 2013, 04:51 AM   #473
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Qusp : thanks for your advice and it's great idea to use PCB as shims.

Do you mean that I have to put two layer of kerotherms for the FETs?
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Old 3rd March 2013, 05:20 AM   #474
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no, I mean

mosfet/resistor->keratherm->heatsink

has 2 less interfaces and thus less thermal impedance vs

mosfet/resistor->keratherm->copper->thermal grease or keratherm->heatsink

heat spreaders are always a worse performing solution vs direct connection, it doesnt matter if its copper or not (even silver), it will always create more thermal resistance.
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Old 3rd March 2013, 10:06 PM   #475
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Thanks, but I think using copper to transfer heat is better than use the case floor.

do I need keratherm for the zfoil? As it is isolated.
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Old 4th March 2013, 09:04 PM   #476
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not that copper, it doesnt look very flat and can bend during use pretty easily at only 2mm and unless you can get very good contact it'll be much worse than the floor. depending on the case the floor may be enough by itself, its certainly easier. you dont need it for the zfoils, but I still use it, just because it gives a good even connection. you could use thermal grease, silver or ceramic paste, but they get messy and most dry out and need changing every now and then. you need something, cant just connect directly, it wont make good thermal contact.
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Old 4th March 2013, 10:01 PM   #477
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Thanks qusp, you remind me lot of points that I haven't considered.
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Old 9th March 2013, 01:34 PM   #478
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The Heaksink of my case is not high enough for the NDT1 to mount on it directly. I have to try my initial plan to use the copper plate as heat pipe.
Spent several hours to drill holes and fixed the PCB onto the plate. Checked all FETs and zfoil no short, then power up, no smoke.

PSU output between 44.95 - 45.03V, DC at output around 22.6V. Everything seems working. The temperature raises to 55 deg C within several minutes.

The heat conducting of the copper is far worse than expected. The portion attached with FETs follow the temperature of the FET but remain at 30 deg. C at the other end.

Don't want to fix it onto the case floor at the moment, I have to carefully plan how to place so many devices into the case.
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Old 9th March 2013, 02:45 PM   #479
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just means you dont need the heatsink, the copper and air is doing a good job getting rid of the heat by itself before it conducts to the other end, which I would expect with that much surface area, just have to watch bending it so contact stays good.

its actually flatter than I thought too, the oxidizing on other side makes it look less level than it is.

Last edited by qusp; 9th March 2013 at 02:49 PM.
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Old 16th March 2013, 04:52 PM   #480
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Replaced the copper plate with heatsink but the size is too small, the temperature raised to near 70 deg and still going up. double the size by using heat transfer glue to stick two heatsinks together.

After power for half hour, temperature stabled at 68.x deg.
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