8 Channel Class D Based on TAS5706A

aramosfet · 9th April 2009, 04:32 PM

Hi All, I've just started a 8 channel Class D amp based on TI TAS5706A, I've finished the first stage of schematics. I'm designing 4 TAS5706A modules which will then be plugged on to a Base board with an ARM7 microcontroller for all the i2c and control stuff. Does the TAS5706 require any additional heatsink apart from the PCB copper layer? I've attached a block diagram. i can also attach the schematics if anyone is interested.

kenpeter · 9th April 2009, 04:56 PM

The TAS5706 EVM2 PCB is roughly 2 inches by 3 inches...
Has a serious groundplane. Presumably for heatsinking?
I've tested hundreds, never even felt one get warm.

But my procedure is fairly brief, I can't say for sure
what happens in extended use? And I'm just a test
monkey, not a real engineer who knows anything.

I'd have to point you to TI's spec sheet.

kenpeter · 10th April 2009, 04:37 PM

I noticed one other detail that might prove helpful.

The ground pad on top, the one the TAS5706 gets
soldered to. Its got a small array 6x6 (36 in total)
vias through to the ground plane on the backside...

Not sure if thats for thermal or other reasons?

aramosfet · 12th April 2009, 07:37 AM

Well it'd be impossible for me to solder the thermal pad on the TAS5706A without some kind of hot air or BGA rework tool. So i'm planning to have 4 - 5 0.1" PTH holes so i can solder the pad and fill up PTH. I guess this will give better thermal conductivity than the tiny vias used in the EVM.
Another question is that, can i use standard 0.1" berg strip headers to provide power supply to the TAS5706A. Will this be able to handle the current? Of course i'm using 6 pins for PVCC and 12 for Gnd on the main connector, instead of a single pin.

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9th April 2009, 04:56 PM	#2
kenpeter diyAudio Member Join Date: Nov 2007 Location: Dallas	The TAS5706 EVM2 PCB is roughly 2 inches by 3 inches... Has a serious groundplane. Presumably for heatsinking? I've tested hundreds, never even felt one get warm. But my procedure is fairly brief, I can't say for sure what happens in extended use? And I'm just a test monkey, not a real engineer who knows anything. I'd have to point you to TI's spec sheet.

10th April 2009, 04:37 PM	#3
kenpeter diyAudio Member Join Date: Nov 2007 Location: Dallas	I noticed one other detail that might prove helpful. The ground pad on top, the one the TAS5706 gets soldered to. Its got a small array 6x6 (36 in total) vias through to the ground plane on the backside... Not sure if thats for thermal or other reasons?

12th April 2009, 07:37 AM	#4
aramosfet diyAudio Member Join Date: Feb 2004 Location: bangalore	Well it'd be impossible for me to solder the thermal pad on the TAS5706A without some kind of hot air or BGA rework tool. So i'm planning to have 4 - 5 0.1" PTH holes so i can solder the pad and fill up PTH. I guess this will give better thermal conductivity than the tiny vias used in the EVM. Another question is that, can i use standard 0.1" berg strip headers to provide power supply to the TAS5706A. Will this be able to handle the current? Of course i'm using 6 pins for PVCC and 12 for Gnd on the main connector, instead of a single pin.