lm3875t? or lm3875tf

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thanks

now that i got this case together i wana make it a gainclone instead;)
 

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Peter Daniel said:
I wouldn't think so. The chip transfers less heat to the heatsing, when it's insulated;)

that's not the way the thermodynamics work, the R(t) of the insulation is a barrier has to be added in -- I worked this chart up which illustrates NSM's recommended oC/W ratings (left Y-axis) at various rail voltages (X-axis), P(out) and P(d) are illustrated on the right Y-axis. A lower oC/W is a larger heat sink, in every case the increase is 1 unit of oC/W.
 

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