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Chip Amps Amplifiers based on integrated circuits

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Old 14th December 2003, 02:15 PM   #11
ronc is offline ronc  United States
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Join Date: Mar 2003
The heat transfer area on a TO-3 package is on the surface of the lower parabolic base.I was thinking more of a 3x4" finned rectangular
HS with the chip mid point or on the leading edge.I am looking at something that will fit on top of my standard hammond Al case i use for mono blocks.
ron
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