I have 2 x ba150 PCB
Is there anything wrong with stacking them ontop of each other to attach to the heatsink, so i only have to use a heatsink down one side of the amp? They wont fit next to each other but there is enough clearence to stack.
The downside would be heat from the bottom chips heating the top chips.
If you could stagger the bottom and top chips it would help.
Is there room to rotate 90 and place them vertically? or at some angle?
(I don't know what a ba150 looks like)
Yes, the heat part.
Internal to the box, put a small quiet fan to keep the air circulating.
Heat sink, is it thick enough so it does not get a hot spot and yes the bottom one could raise the equivalent ambient for the upper one.
Maybe one above the other but staggered to one side as much as possible.
i.e. bottom one left as far a possible; top one right as far as possible
Invert the top one to get it mounted as low as possible on the heat sink.
Might not look nice but pick your priority.
Here's a couple pics of a build using the vertical approach. Obviously the chassis format has to follow along, but it solves the heat flow interaction thing.
I like the compact idea...been there / done that.
The only problem is troubleshooting...if ever required.
You are correct, but I suspect anything other than side by side of some arrangement will present the same difficulty. Here is another approach from a different builder using the same boards. You might PM him about the heat situation.
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