I have a rather small heatsink for my LM4780's.
Each chip is running in a parallel setup and I'm limited on space.
Because of this I am building a detached power supply.
My heatsink is vertical fin 3.5" wide, 3.75" High & 1.5" fins with a .3875" thick base, there are 16 smooth fins.
I have another heatsink that I was thinking about using as the pressure plate to hold the chip to the heatsink.
What do you think?
The heatsink pressure plate should assist in thermal dissipation.
Each chip is running in a parallel setup and I'm limited on space.
Because of this I am building a detached power supply.
My heatsink is vertical fin 3.5" wide, 3.75" High & 1.5" fins with a .3875" thick base, there are 16 smooth fins.
I have another heatsink that I was thinking about using as the pressure plate to hold the chip to the heatsink.
What do you think?
The heatsink pressure plate should assist in thermal dissipation.
Attachments
Not quite the tool you're looking for -- here's Aavid Thermalloy's bonded fin heat sink thermal impedance calculator:
- heatsink design tools
- heatsink design tools
Not at all.
The heatsinks above are clearly extruded, not bonded fin; they are completely different beasts.
They are different in that you can fit more fins in a bonded fin heatsink, for a given amount of space they are much more efficient than extrusions.
Here's another calculator:
Cold Plates, Heat Sinks, Peltier Coolers, Heat Spreaders
Here's another calculator:
Cold Plates, Heat Sinks, Peltier Coolers, Heat Spreaders
As Lauren Bacall said to Humphrey Bogart: "Just pucker up and blow". As soon as the heat sink starts hotting up air starts moving -- obviously not like a fan at 200 LFM, but at some low tens of LFM.
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