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#1 |
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diyAudio Member
Join Date: Feb 2008
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Hi, please anybody verify my TAS5615 amplifier PCB for design rule and problems. I design this PCB with the help of TI application notes SLAU290. But the TI design is double layer PCB and my design is a single layer...
I am using a desktop CPU processor heat sink here. All the SMD components are in topside [soldering side] and all through through hole components are in others side[opposite to heat sink and all SMD components].. ![]() And i want make sure about one-thing may i use the same PCB for TAS5630 amp[because these two's are pin compatible ]... If anybody want this PCB i am happy to give you this in PROTEL ASCII format but i want to verify the design first...
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#2 |
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diyAudio Member
Join Date: Feb 2008
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here is the PCB is pdf format.
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#3 |
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diyAudio Member
Join Date: Sep 2008
Location: MP
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you can use TAS 5630 and TAS 5615 interchangeably without problems.
I think you are using SMD caps for A & D channel bootstraps whereas through hole caps for B & C channels. can you explain the reason. Last edited by jash2008; 18th March 2010 at 08:37 AM. |
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#4 |
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diyAudio Member
Join Date: Feb 2008
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I always like to place through hole components[because of availability]. But there is a track is running between two terminals of the capacitor [This is the problem in single layer design]. Is there any problem in this. May i use smd and through hole cap together?... will they create any problem...
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#5 | |
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diyAudio Member
Join Date: Sep 2008
Location: MP
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Quote:
You may use but preferably you should use SMD for class D application with keeping the tracks as short as possible. But the bootstraps must be SMD and as close to pins as possible |
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