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Old 14th March 2012, 11:10 PM   #1
chipper is offline chipper  United States
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Default MOSFET dies

Can I ask why is the IRF3205 fet die smaller than than a MTP75N05HD fet die?? This is a new IRF3205 fet that I cracked open out of curiosity and a old shorted 75N05HD fet to compare dies. Can someone explain what they do and does it lose power handling?
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Old 14th March 2012, 11:44 PM   #2
CBS240 is offline CBS240  United States
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What is purpose of the transistor in the circuit, switch? or analog output?

There are different fabrication processes that make 'vertical' type mosfets, that is typically they exhibit exponential transfer. Hexfet is a type of multi-cellular architecture, many small transistors in parallel across the die. During high conduction each transistor cell exhibits negative temp co (decrease in conductance vs temperature), so the current is better shared across the die, thus they do not 'hot spot' like BJT's do. Planer Stripe is a more recent semi fab process that seem to be similar to hexfets in that they also have neg temp-co between the stripes, making them suitable for analog outputs. Trench-Fets and U-Fet is another semi-fab that produces very low Rds on, great for switching but are not suitable for analog output as they tend to hot-spot under those conditions.
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Old 15th March 2012, 12:02 AM   #3
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Semiconductor manufacturers are always trying to get more components from a wafer. This reduces the cost of each component. It appears that the most important criteria are the current ratings. If they can make a smaller die that can pass the same amount of current, they will use the smaller die (or at least make it available as a substitute).

As an example, the IRFZ44 (no suffix) typically has the largest die of all of the IRFZ44 FETs (Z44N, Z44V...). This makes it able to handle high current transients better but otherwise it's about the same as the other versions.
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