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#2661 | ||||
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diyAudio Member
Join Date: Mar 2011
Location: St Louis, Mo
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Quote:
Quote:
If I changed the output device patterns to TO126/TO225 padstacks rather than the combination SOT23 and SOT223, dropped support for thru-hole capacitors, and used dual-transistor packages, I might be able to get it down to the API-2520 footprint size. Quote:
I'd be more inclined to make a two-story assembly, as Scott showed in his last prototype. Even that's not a good solution for physically small assemblies like this, since the connections from one PWB to the next use up a significant portion of the available acreage. (I.e., adding a second PWB to the assembly doesn't double the available board space - after subtracting the area used by the interconnections, the increase may be only 50% .) Quote:
Dale |
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#2662 | |
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diyAudio Member
Join Date: Mar 2011
Location: St Louis, Mo
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Thanks for taking the time to evaluate this. I'm taking your suggestions seriously. For now, many of your comments can be incorporated by simply leaving parts off the assembly, though eliminating their locations on the PWB is attractive. The signal input traces are quite short (conscious effort to make them short), but I can open up the bottom-side ground plane in that vicinity.
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Dale |
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#2663 |
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diyAudio Member
Join Date: Mar 2005
Location: Cubicle Sweet Cubicle, Springfield, Missouri, USA
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"Depending on your experience with SMT assemblies, and the soldering tools available to you, removal and replacement of individual components will be slightly, to extremely, challenging." dscisholm
TO SAY THE LEAST! I think Scott's original idea of a sandwich of two boards seperated by spacers is the way to go for thru hole. If both boards have ground planes then arranging them face to face with the components on the ground plane side will provide an excellent shield for the VHF jfet input devices. That's what I'm gona do. Also the ground plane side will still allow a hybrid of both SMT and thru hole parts allowing both SMT and thru hole devices. The only drawback is once the two boards are together it will be a real downer to replace parts. So it would be necessary to pre-test the input board and output board before they are joined or place the parts on the two outside sides. Also to92 dif-amp jefts and current mirror BJTs allow their flat sides to be epoxed together making them more temp stable to drifting and also pushing them closer to the board surface. The board just needs more room to allow easier soldering for home constructors. Just my two cents! Ray
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" Where's the KABOOM? There is supposed to be an earth shattering KABOOM." MM |
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#2664 | |
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diyAudio Member
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Quote:
DIP8 duals are out of the question for SWOPA, but singles are probably at the fringe of feasibility with a two-story assembly with the gain stages on one, and the buffer on the other. Both boards can be mounted perpendicularly on the base board, which will have the pads for the DIP8 pins, and maybe a few odds and ends like bypass caps, compensation networks, etc. Signals may be routed between the gain stage and buffer stage through struts (of which at least 2 are needed anyway for mechanical support), or to rectangular pads at the lower edge, to the base board and across to the other side (of course, this is tricky because of parasitics, crosstalk, etc., but it should be ok for nodes without significant voltage swing, or tracks without significant current swing). Up to 8-12 rectangular pads are feasible at the board edge, though it's more common to use around 5-6. Some of these will be consumed by V+, V-, Comp, Earth, In-, In+, etc., but a few may still be feasible for inter-board signals. |
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#2665 |
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diyAudio Member
Join Date: Mar 2005
Location: Cubicle Sweet Cubicle, Springfield, Missouri, USA
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There are a host of footprints out there; The Deane Jensen 990, The Pacific Recorders 990, the John Hardy 990, the API2520 and DIP8. And what about FM Acoustics modules? I think there probably needs to be an adapter for each case. And in each case I don't think this is gona be plug and play. Ray
__________________
" Where's the KABOOM? There is supposed to be an earth shattering KABOOM." MM |
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#2666 | |
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diyAudio Member
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But as Scott pointed out, it's not an SMD issue per se, and he once cited an example of very thin on-chip parts (800 atomic layers if memory serves) that work just fine. Evidently that's enough layers to make spooky mesoscopic effects still remain small Brad |
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#2667 |
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diyAudio Member
Join Date: Jun 2004
Location: Milano
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Scott,
What is the recommended offset nulling scheme? WRT the schematic of the input gain stage in your post #2643, a trimmer between the upper current mirror emitters (U1 emitter and W6 terminal) with the wiper connected to positive rail? Also, is output current limiting necessary / advisable for the output buffer? WRT the schematic in post #2593 a diode clamp (two anti-paralleled connected diodes) between output and the center tap of the 30K9 resistor to be split into two resistors? Thank you (for the great learning experience) Giorgio |
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#2668 | |
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diyAudio Member
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Clay is embedded in our subconscious. It has been there for at least 50,000 years. |
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#2669 |
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diyAudio Member
Join Date: Jan 2006
Location: Avalon Island
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Scott,
Within the ad797 datasheet there is a reference to using an output resistor for almost any capacitive load. I dont fully understand its purpose. Can you explain? And would it be worth while to include such a device on the circuit board?
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Just because you can't hear it doesn't mean no one can. |
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#2670 | |
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diyAudio Member
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This is common, the output impedance rises with frequency so it looks inductive and a cap load can make it oscillate. Usually a small R like 25-50 Ohms helps. The addition of a capacitor from the output back to the inverting input provides AC feedback without "seeing" the cap load. This stuff usually helps well outside the audio band. BTW even an open-loop emitter follower can oscillate, but that is usually 100's of MHz and not seen easily on the scopes DIY'ers often use.
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Clay is embedded in our subconscious. It has been there for at least 50,000 years. |
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